Build your process with Cee® spin coaters, bake plates, spin developers, and temporary wafer bonding and debonding systems. Configure individual instruments, integrated workstations, or custom equipment around your application.
Engineered, assembled, and supported in the United States with tens of thousands of units serving education, research, and production worldwide.
Hands-on process development and automated cassette runs in one workstation. Work across multiple wafer sizes, then connect spin coating, baking, and developing with integrated wafer handling.
SECS/GEM enables standardized communication between manufacturing equipment and factory host systems. Cee® plans to introduce this capability in 2027, with equipment availability and configuration details to follow.
Air-driven, on-demand delivery for aqueous solutions. Draw material from a supply bottle and feed spray nozzles on Cee® developers, with secondary containment.
On-demand heated dispensing for aqueous developing and cleaning solutions. Define temperatures in DataStream™ recipes, with real-time monitoring and adjustable setpoints up to 80°C.
Equipment for thin wafer handling and advanced packaging process development.
Bring your temporary bonding process together with Cee® equipment for adhesive coating, baking, bonding, debonding, and cleaning. Our team can help you identify equipment and configurations for your application.
Cee® workstations combine compatible coating, baking, and cleaning modules, complementing dedicated bonding and debonding equipment. Between bonding and debonding, wafers transfer to other tools for thinning or backside processing.
Researchers used an Apogee® spin-coater module in an X-Pro II Workstation to deposit OSTE-AS polymers for silicon integration.
See how they prepared the coatings, adjusted film thickness with spin speed, and bonded the polymers to silicon.
At the University of Michigan’s Lurie Nanofabrication Facility, researchers use an Apogee® spin coater to apply photoresist to small substrate pieces and full wafers.
Their equipment guide walks through getting ready to coat, from choosing the right chuck to setting up a recipe.
A manufacturer came to us with a cleaning challenge: reaching deep trenches and narrow channels while protecting delicate features.
We built a custom solution around an Apogee® 450 developer, adding a programmable megasonic arm and recipe control in an X-Pro II Workstation.
Compare models, understand configuration options, and prepare for an equipment quotation.
Explore equipment choices and process considerations for temporary wafer bonding and debonding.
Explore research, application studies, process explanations, and equipment documentation.
Tell us about your substrates, materials, process steps, and throughput requirements. Our team can help identify equipment and configuration options for your application.
Already using Cee® equipment? Contact Technical Support.
When you need reliable wafer processing, it’s not just about specs, it’s about results. Our high-performance systems deliver flexibility, repeatability, and long-term value. Labs and fabs around the world move faster, scale smarter, and get it right again and again with Cee®.
SEMICON EUROPA · 10–13 NOVEMBER
Meet Jacob, CEE’s Global Sales Director, in Munich with our partner SiSTEM Technology.
Stand C1353 · Messe München
Spin coating, bake and chill, temporary bonding and debonding.
Mention Jacob from CEE in SiSTEM’s booking form.
