Build your process with Cee® spin coaters, bake plates, spin developers, and temporary wafer bonding and debonding systems. Configure individual instruments, integrated workstations, or custom equipment around your application.
Engineered, assembled, and supported in the United States with tens of thousands of units serving education, research, and production worldwide.
Hands-on process development and automated cassette runs in one workstation. Work across multiple wafer sizes, then connect spin coating, baking, and developing with integrated wafer handling.
SECS/GEM enables standardized communication between manufacturing equipment and factory host systems. Cee® plans to introduce this capability in 2027, with equipment availability and configuration details to follow.
Air-driven, on-demand delivery for aqueous solutions. Draw material from a supply bottle and feed spray nozzles on Cee® developers, with secondary containment.
On-demand heated dispensing for aqueous developing and cleaning solutions. Define temperatures in DataStream™ recipes, with real-time monitoring and adjustable setpoints up to 80°C.
Equipment for thin wafer handling and advanced packaging process development.
Bring your temporary bonding process together with Cee® equipment for adhesive coating, baking, bonding, debonding, and cleaning. Our team can help you identify equipment and configurations for your application.
Cee® workstations combine compatible coating, baking, and cleaning modules, complementing dedicated bonding and debonding equipment. Between bonding and debonding, wafers transfer to other tools for thinning or backside processing.
Researchers used an Apogee® spin-coater module in an X-Pro II Workstation to deposit OSTE-AS polymers for silicon integration. The published study reports thinner films at higher spin speeds for its tested formulation.
The result shows why material and recipe should be evaluated together.
The University of Michigan’s Lurie Nanofabrication Facility lists a programmable Apogee® spin coater for photoresist processing, with chucks for substrate pieces and wafers.
Its operating guidance highlights matching the chuck to the sample and following material-specific recipes.
A custom Apogee® 450 developer combined a programmable megasonic arm with recipe control in an X-Pro II Workstation to address difficult substrate cleaning.
The case study shows how acoustic cleaning, positioning, and process monitoring can be brought into one system.
Compare models, understand configuration options, and prepare for an equipment quotation.
Explore equipment choices and process considerations for temporary wafer bonding and debonding.
Explore research, application studies, process explanations, and equipment documentation.
Tell us about your substrates, materials, process steps, and throughput requirements. Our team can help identify equipment and configuration options for your application.
Already using Cee® equipment? Contact Technical Support.
When you need reliable wafer processing, it’s not just about specs, it’s about results. Our high-performance systems deliver flexibility, repeatability, and long-term value. Labs and fabs around the world move faster, scale smarter, and get it right again and again with Cee®.
SEMICON EUROPA · 10–13 NOVEMBER
Meet Jacob, CEE’s Global Sales Director, in Munich with our partner SiSTEM Technology.
Stand C1353 · Messe München
Spin coating, bake and chill, temporary bonding and debonding.
Mention Jacob from CEE in SiSTEM’s booking form.
