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AccuScan™ Dispense

The Cee® AccuScan™ Dispense is designed for use with the Apogee® Spin Developer, to provide precise and uniform dispensing for semiconductor substrates. This automated dispense system enhances the efficiency and accuracy of your process, ensuring optimal performance in semiconductor fabrication.

Use Cases

  • High-pressure impingement spray
  • Precision dispense
  • Breaking surface tension
  • Metal lift-off

Specifications

  • fully programable center-to-edge 
  • resolution 0.1mm
  • speed 0-50 mm/s
  • drip free park position
  • 2 dispense + N2 blow-off (max)
  • works with pressure cans, and pumps
A photo of the Cost Effective Equipment (Cee®) AccuScan™ Developer Arm.

High pressure impingement spray: removes tough residues from wafer surface
Precision dispense: recipe controlled dispense position
Breaking surface tension: enhances liquid spread & wetting for better substrate coverage
Metal lift-off: precision removal of unwanted metal layers
Off-wafer pre-dispense: dispense in the park position to flush nozzle before on-wafer dispensing

…but wait! The Cee® AccuScan™ isn’t just for Apogee® Developers. Click here for details on how it can also boost accuracy and performance for your Apogee® Spin Coater!