The Cee® AccuScan™ Dispense is designed for use with the Apogee® Spin Developer, to provide precise and uniform dispensing for semiconductor substrates. This automated dispense system enhances the efficiency and accuracy of your process, ensuring optimal performance in semiconductor fabrication.
Related Information
High pressure impingement spray: removes tough residues from wafer surface
Precision dispense: recipe controlled dispense position
Breaking surface tension: enhances liquid spread & wetting for better substrate coverage
Metal lift-off: precision removal of unwanted metal layers
Off-wafer pre-dispense: dispense in the park position to flush nozzle before on-wafer dispensing
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