Debonding is a vital step in advanced semiconductor manufacturing and 3D Packaging that involves separation of the device wafer from its carrier. This article includes
Indium phosphide (InP) wafers present challenges in bonding/debonding due to thermal mismatch, surface damage risks, and material compatibility issues. Cee® provides precision wafer handling tools
Wafer bonding is crucial for compact and powerful devices. It involves coating a full thickness wafer with adhesive, bonding it to a support carrier wafer,
This article explores automated dispense options for spin coating applications in the semiconductor industry including cartridge dispense, pressure can dispense, and disposable syringe dispense. The
Nitrogen purge is widely employed in the manufacturing of semiconductors. It is utilized to establish a low-oxygen setting for processing substrates. This method helps remove
The cotton candy effect is a common issue in the semiconductor manufacturing process where dried material comes off the substrate in string-like filaments instead of
Hotplate baking is a popular technique for film drying and curing, offering advantages over traditional convection ovens such as decreased bake time, increased uniformity, reproducibility,
The use of immersion tank processes in photolithography has decreased due to excessive material consumption, non-uniform resolution, and poor clearing from high-aspect-ratio features. Spin developing
Smart-Pin technology enables flexible temperature ramping and uniform baking for thermal shock sensitive materials. The lift pin height recipe utilizes a temperature matrix for soft
Spin-coating is a process used to evenly distribute material on a substrate by spinning it at a high speed. Round substrates are commonly used because
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